JCU proposal process in SAP, MSAP, and any-layer processes.
Etching process suitable for hydrogen peroxide/sulfuric acid etching equipment.
We propose a "Copper Pressure Adjustment Etching Process" aimed at thinning copper pressure and flattening the uneven surface of copper. This process suppresses pitting corrosion (etching pits) that occurs during the etching treatment of filling plated products. Additionally, it is compatible with hydrogen peroxide/sulfuric acid-based etching equipment. 【Features】 - Optimal etching speed for copper pressure adjustment (3-7 μm/min) - Compatible with hydrogen peroxide/sulfuric acid-based etching equipment - Stable management of operating bath component concentration through quantitative replenishment using a sheet counter *For more details, please download the PDF or feel free to contact us.
- Company：JCU 本社
- Price：Other
